The object
Roberto Crippa co-developed advanced probe cards that electrically connect semiconductor wafers to test equipment before chips are packaged. The Technoprobe team’s high-frequency, alignment and routing advances support accurate testing of dense and mixed-signal devices, reducing failures and waste in modern chip manufacturing.
01
What Roberto did
Co-developed Technoprobe’s advanced probe-card technologies for wafer-level semiconductor testing.
02
Why it matters
The EPO credits the team’s cards with signal integrity to 110 GHz and with enabling European semiconductor makers to obtain critical local testing tools.
03
Living-status check
The European Patent Office named Crippa a 2026 European Inventor Award finalist and identifies his ongoing executive role at Technoprobe.